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Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler
Woochang Kim1,2, Chihyun Kim1,2, Wonseok Lee2
1Department of Applied Nano Mechanics, Korea Institute of Machinery and Materials, 156 Gajeongbuk-ro, Daejeon 34103, Korea.
Biomolecules
|January 27, 2021
Summary
This study introduces a novel copper-based thermal interface material (TIM) using multi-dimensional fillers. This safe, low-cost TIM offers high thermal conductivity for effective heat dissipation.
Area of Science:
- Materials Science
- Nanotechnology
- Polymer Science
Background:
- Thermal interface materials (TIMs) are crucial for reducing heat transfer resistance between electronic components.
- Silver-based TIMs offer high thermal conductivity but are limited by cost and toxicity.
- Copper is an abundant, non-toxic alternative with potential for advanced TIM applications.
Purpose of the Study:
- To develop a safe, low-cost, and highly thermally conductive TIM using a novel copper-based multi-dimensional filler.
- To investigate the efficacy of combining microscale copper flakes, multi-walled carbon nanotubes (MWCNTs), and copper nanoparticles (Cu NPs).
Main Methods:
- Synthesized copper nanoparticles (Cu NPs) via microwave irradiation.
- Bound Cu NPs to MWCNTs, then incorporated them with copper flakes into a polyimide matrix.
- Fabricated a stable TIM paste and measured its cross-plane thermal conductivity.
Main Results:
- Developed a copper-based TIM paste exhibiting stability in high-temperature environments.
- Achieved a cross-plane thermal conductivity of 36 W/m/K for the copper-based TIM.
- Demonstrated the potential of a multi-dimensional copper filler system for enhanced thermal management.
Conclusions:
- The developed copper-based TIM offers a promising alternative to silver-based materials due to its high thermal conductivity and lower cost.
- The multi-dimensional filler approach effectively enhances thermal performance.
- This copper-based TIM shows significant potential for industrial applications in heat dissipation.
