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Bi-Phasic Ag-In-Ga-Embedded Elastomer Inks for Digitally Printed, Ultra-Stretchable, Multi-layer Electronics.

Pedro Alhais Lopes¹, Daniel Félix Fernandes¹, André F Silva¹

¹Institute of Systems and Robotics, Department of Electrical Engineering, University of Coimbra, Coimbra 3030-290, Portugal.

ACS Applied Materials & Interfaces

|March 10, 2021

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A novel silver-indium-gallium (Ag-In-Ga) ink offers extreme stretchability and high conductivity for printable electronics. This advanced ink enables the creation of durable, multi-layer stretchable circuits on various substrates, even at room temperature.

Area of Science:

Materials Science
Nanotechnology
Conductive Inks

Background:

Existing liquid metal alloys like eutectic gallium-indium (EGaIn) present challenges in printability and substrate adhesion.
The development of highly conductive and stretchable inks is crucial for advanced electronic applications, including wearable devices and flexible sensors.
There is a need for printable electronic materials that maintain performance under mechanical strain and can be processed at low temperatures.

Purpose of the Study:

To introduce a novel bi-phasic ternary Ag-In-Ga ink with superior electrical conductivity, stretchability, and low electromechanical gauge factor (GF).
To demonstrate the direct writing of ultrathin, multi-layer stretchable circuits using this ink and an extrusion printer.
To evaluate the ink's performance, including conductivity, stretchability, GF, and durability under repeated strain cycles.

Keywords:

EGaIn-Ag bi-phasic conductive ink conductive stretchable ink eutectic gallium−indium alloy printed stretchable electronics soft and flexible electronics styrene block copolymer styrene-isoprene block copolymers (SIS)

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Main Methods:

Synthesis of the Ag-In-Ga ink by combining eutectic gallium-indium (EGaIn), silver (Ag) microflakes, and styrene-isoprene block copolymers.
Characterization of the ink's properties, including electrical conductivity, maximum strain, and electromechanical gauge factor (GF).
Direct writing of multi-layer circuits using a commercial extrusion printer on various substrates, followed by room-temperature sintering.

Main Results:

The Ag-In-Ga ink achieved high electrical conductivity (7.02 × 10^5 S m^-1) and extreme stretchability (max. strain >600%) with a low GF (0.9).
The ink demonstrated robust performance, with no significant resistance change after 1000 strain cycles.
Microscopic analysis revealed the formation of AgIn2 microparticles, contributing to the ink's cohesive bi-phasic structure and enhanced properties compared to composites without EGaIn.

Conclusions:

The developed Ag-In-Ga ink is a highly printable, nonsmearing alternative to traditional liquid metal alloys, offering excellent conductivity and stretchability.
The ink facilitates the stencil-free, digital printing of durable, multi-layer stretchable circuits compatible with heat-sensitive substrates and medical adhesives.
This material advancement opens new possibilities for fabricating advanced stretchable electronics for diverse applications.