Impact Modifiers and Compatibilizers for Versatile Epoxy-Based Adhesive Films with Curing and Deoxidizing...

Area of Science:

• Materials Science
• Polymer Chemistry
• Surface Engineering

Background:

• Epoxy resins with acidic compounds offer excellent adhesion, robustness, and deoxidizing properties.
• Semiconductor packaging requires advanced adhesives with curing and deoxidizing capabilities.

Purpose of the Study:

• To fabricate hybrid adhesive films with deoxidizing and curing capabilities for semiconductor packaging.
• To investigate the compatibilizing effects and mechanical properties of various additive binders and compatibilizing agents.
• To optimize film formation and deoxidizing abilities for electronic device applications.

Main Methods:

• Fabrication of hybrid adhesive films using thermoplastic amorphous polymers and compatibilizing agents.
• Systematic investigation of curing, deoxidizing, thermal, and rheological properties.
• Selection of a model adhesive film comprising a thermoplastic-thermoset mixture with benzoic acid and polycarbonate.

Main Results:

• A thermoplastic-thermoset mixture with benzoic acid and polycarbonate demonstrated uniform film formation and maximized deoxidizing abilities.
• The presence of phenyl and acidic groups in the compatibilizing agent was crucial for achieving deoxidizing and compatibilizing effects.
• The developed hybrid adhesive film exhibited effective deoxidization and adhesion properties.

Conclusions:

• The hybrid adhesive film, incorporating specific thermoplastic-thermoset components, is suitable for semiconductor packaging.
• The study highlights the importance of functional groups in compatibilizing agents for achieving desired adhesive properties.
• This innovation offers a promising solution for electronic devices demanding enhanced deoxidization and adhesion.