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Highly Thermally Conductive Graphene-Based Thermal Interface Materials with a Bilayer Structure for Central
Zhi-Guo Wang1, Jia-Cheng Lv1, Zi-Li Zheng1
1College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, China.
ACS Applied Materials & Interfaces
|May 19, 2021
Summary
New thermal interface materials (TIMs) using maltose-g-graphene/gelatin composite films offer superior CPU cooling. These advanced materials provide enhanced thermal conductivity and stability for demanding electronic applications.
Area of Science:
- Materials Science
- Nanotechnology
- Thermal Engineering
Background:
- Miniaturization of central processing units (CPUs) leads to heat accumulation, necessitating effective thermal management.
- Thermal interface materials (TIMs) are crucial for heat dissipation and ensuring device reliability.
- Existing TIMs face challenges in meeting the demands of increasingly powerful and compact electronics.
Purpose of the Study:
- To develop novel, high-performance TIMs for efficient CPU cooling.
- To investigate the potential of maltose-g-graphene as a structural motif in TIMs.
- To evaluate the thermal conductivity, anisotropic properties, and stability of the developed TIMs.
Main Methods:
- Maltose-assisted mechanochemical exfoliation to prepare maltose-g-graphene.
- Two-step vacuum filtration to create bilayer composite films of maltose-g-graphene/gelatin.
- Characterization of thermal conductivity, anisotropic ratio, and thermal stability.
Main Results:
- The maltose-g-graphene/gelatin composite films exhibited a remarkable in-plane thermal conductivity of 30.8 W m-1 K-1.
- A strong anisotropic ratio of approximately 8325% was achieved at 40 wt % maltose-g-graphene.
- The developed TIMs demonstrated superior CPU cooling performance compared to commercial thermal pads.
- Excellent thermal conductive stability under thermal shocks and fatigue was observed.
Conclusions:
- Maltose-g-graphene/gelatin composite films represent a promising high-performance TIM for CPU cooling.
- The unique bilayer structure facilitates directional heat transfer, enhancing cooling efficiency.
- These materials offer a valuable solution for surmounting harsh application scenarios in electronics cooling.
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