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Graphene Infused Ecological Polymer Composites for Electromagnetic Interference Shielding and Heat Management
Klaudia Zeranska-Chudek1, Anna Wróblewska1, Sebastian Kowalczyk2
1Faculty of Physics, Warsaw University of Technology, Koszykowa 75, 00-662 Warsaw, Poland.
Materials (Basel, Switzerland)
|June 2, 2021
Summary
This study presents eco-friendly polymer composites with graphene nanoplatelets for advanced electromagnetic interference (EMI) shielding and thermal management in electronics packaging. These materials offer high EMI shielding efficiency and thermal conductivity.
Area of Science:
- Materials Science
- Polymer Science
- Nanotechnology
Background:
- Mobile electronics and aerospace demand advanced materials for packaging.
- Conventional materials face limitations in cost, size, and functionality.
- Multifunctional polymer composites offer promising alternatives.
Purpose of the Study:
- To investigate eco-friendly, dual-functional polymer composites for EMI shielding and heat management.
- To explore polylactic acid/graphene nanoplatelet composites with varying loadings and flake sizes.
- To optimize material properties for electrical device packaging.
Main Methods:
- Fabrication of polylactic acid/graphene nanoplatelet composites with up to 15 wt% loading.
- Characterization of composites with graphene nanoplatelet lateral sizes of 0.2, 5, and 25 μm.
- Measurement of electromagnetic interference (EMI) shielding efficiency (0.2–12 GHz) and thermal conductivity.
Main Results:
- Achieved EMI shielding efficiency exceeding 40 dB for a 1 mm thick sample.
- Obtained thermal conductivity of 1.72 W/mK at 15 wt% nanofiller loading.
- Demonstrated influence of nanofiller lateral size on material properties.
Conclusions:
- Polylactic acid/graphene nanoplatelet composites exhibit significant dual functionality for EMI shielding and thermal management.
- Material properties can be tuned by adjusting graphene nanoplatelet loading and lateral size.
- These composites represent viable, cost-effective alternatives for electronic packaging applications.

