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Quantum Emitter Localization in Layer-Engineered Hexagonal Boron Nitride
James Callum Stewart1, Ye Fan1, John S H Danial2
1Department of Engineering, University of Cambridge, 9 JJ Thomson Avenue, Cambridge CB3 0FA, United Kingdom.
ACS Nano
|August 4, 2021
Summary
Researchers precisely located quantum emitters in hexagonal boron nitride (hBN) across all three dimensions. This breakthrough enables scalable, 2D quantum device fabrication for advanced photonic circuits.
Area of Science:
- Quantum optics and photonics
- Materials science and engineering
- Solid-state physics
Background:
- Hexagonal boron nitride (hBN) is a key 2D material for solid-state quantum emitters.
- Deterministic, scalable localization of emitters in 3D remains a significant challenge.
- Maintaining hBN's 2D properties during emitter localization is crucial for device performance.
Purpose of the Study:
- To demonstrate 3D emitter localization in hBN using monolayer engineering.
- To develop methods for controlling and preserving quantum emitter properties.
- To enable scalable fabrication of addressable quantum emitter arrays.
Main Methods:
- Engineered hBN monolayers (MLs) with pre-treatment processes to control emission.
- Utilized differently treated MLs for atomic-layer vertical (z) emitter localization.
- Employed a patterned graphene mask for lateral (x-y) emitter localization via fluorescence quenching.
- Protected ML hBN emitters by sandwiching them between additional hBN MLs to suppress bleaching.
Main Results:
- Achieved deterministic 3D localization of quantum emitters in hBN.
- Demonstrated vertical localization at the atomic layer level.
- Successfully suppressed emitter bleaching in thin hBN stacks.
- Showcased lateral localization using a graphene mask, enabling site-specific control.
Conclusions:
- Monolayer engineering provides a versatile platform for 3D emitter localization in hBN.
- This approach is compatible with scalable, planar processing for quantum device fabrication.
- Enables tailored designs for addressable emitter arrays, monolithic integration, and photonic circuits.
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