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Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics

Jiri Hlina1, Jan Reboun1, Ales Hamacek1

  • 1Department of Materials and Technology, Faculty of Electrical Engineering, University of West Bohemia, Univerzitni 8, 301 00 Pilsen, Czech Republic.

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Summary

This study developed copper-nickel nanoparticle inks for thick printed copper (TPC) technology. The 55:45 alloy ink is ideal for integrated resistors due to low resistance and temperature stability.

Keywords:
contact resistancecopperelectrical propertiesnickelresistive inkthick-film resistor

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Electrical Engineering

Background:

  • Conventional metallization techniques pose limitations in power substrate manufacturing.
  • Thick Printed Copper (TPC) technology offers an alternative for power electronics modules.
  • Resistive inks are crucial for integrating functional components onto substrates.

Purpose of the Study:

  • To develop and characterize copper-nickel nanoparticle resistive inks for TPC technology.
  • To evaluate the suitability of different copper-nickel ratios for resistor applications.
  • To assess the compatibility of these inks with copper films for integrated electronics.

Main Methods:

  • Preparation and deposition of two copper-nickel nanoparticle inks (75:25 and 55:45 ratios) using Aerosol Jet technology.
  • Characterization of electrical parameters, microstructure, and thermal properties.
  • Evaluation of the influence of copper-nickel content on electrical performance.

Main Results:

  • The copper-nickel ink with a 55:45 ratio (constantan nanoparticles) demonstrated superior performance for resistor production.
  • Achieved low sheet resistance of approximately 1 Ω/square.
  • Obtained a low temperature coefficient of resistance (TCR) of ±100 × 10-6 K-1.
  • Copper-nickel inks are compatible with copper films when fired in a nitrogen atmosphere.

Conclusions:

  • Copper-nickel nanoparticle inks, particularly the 55:45 alloy, are highly suitable for fabricating integrated resistors.
  • The developed inks are compatible with TPC technology, enabling direct integration onto ceramic substrates.
  • This advancement facilitates the manufacturing of power electronics modules with enhanced functionality and reduced complexity.