Jan Reboun
3PUBLICATIONS
6CO-AUTHORS
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Publications (3)
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|Jun 10, 2023
Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials.David Kalaš, Radek Soukup, Jan Řeboun
|Feb 25, 2022
Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper.Jiri Hlina, Jan Reboun, Marek Simonovsky
|Nov 27, 2021
Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications.Jiri Hlina, Jan Reboun, Ales Hamacek
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