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Jan Reboun

3PUBLICATIONS
6CO-AUTHORS
Functional materialsElectrical circuits and systems
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Publications (3)

Sort by Publication Date:
|Jun 10, 2023
Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials.

David Kalaš, Radek Soukup, Jan Řeboun

|Feb 25, 2022
Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper.

Jiri Hlina, Jan Reboun, Marek Simonovsky

|Nov 27, 2021
Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications.

Jiri Hlina, Jan Reboun, Ales Hamacek

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Frequent Collaborators

2 joint publications

Jiri Hlina

1 joint publications

Tomas Syrovy

1 joint publications

David Kalaš

1 joint publications

Radek Soukup

1 joint publications

Michaela Radouchová

1 joint publications

Pavel Rous

Frequent Collaborators

2 joint publications

Jiri Hlina

1 joint publications

Tomas Syrovy

1 joint publications

David Kalaš

1 joint publications

Radek Soukup

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