Michaela Radouchová

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4CO-AUTHORS
Functional materials
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Publications (1)

|Jun 10, 2023
Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials.

David Kalaš, Radek Soukup, Jan Řeboun

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Frequent Collaborators

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David Kalaš

1 joint publications

Radek Soukup

1 joint publications

Jan Řeboun

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Pavel Rous