David Kalaš
2PUBLICATIONS
7CO-AUTHORS
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Publications (2)
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|Jun 10, 2023
Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials.David Kalaš, Radek Soukup, Jan Řeboun
|Nov 13, 2021
FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers.David Kalaš, Karel Šíma, Petr Kadlec
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