Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

A Comprehensive Study of Polyurethane Potting Compounds Doped with Magnesium Oxide Nanoparticles.

Polymers·2023
Same author

Study of Internal Stress in Conductive and Dielectric Thick Films.

Materials (Basel, Switzerland)·2022
Same author

Deep Learning Methods for Speed Estimation of Bipedal Motion from Wearable IMU Sensors.

Sensors (Basel, Switzerland)·2022
Same author

Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper.

Materials (Basel, Switzerland)·2022
Same author

Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications.

Materials (Basel, Switzerland)·2021
Same author

FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers.

Polymers·2021

Related Experiment Video

Updated: Jul 27, 2025

A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles
06:21

A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles

Published on: March 13, 2017

10.5K

Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed

David Kalaš1, Radek Soukup1, Jan Řeboun1

  • 1Faculty of Electrical Engineering, University of West Bohemia, Univerzitní 8, 301 00 Pilsen, Czech Republic.

Polymers
|June 10, 2023
PubMed
Summary

This study introduces a new thermo-compression technique for directly connecting electronic components to textiles. This method offers low-resistance, fluid-resistant interconnections for smart textiles.

Keywords:
3D printinge-textileencapsulationinterconnection technique

More Related Videos

Process of Making Three-dimensional Microstructures using Vaporization of a Sacrificial Component
08:31

Process of Making Three-dimensional Microstructures using Vaporization of a Sacrificial Component

Published on: November 2, 2013

9.1K
Author Spotlight: Modular Neuronal Networks for Analyzing Brain Functions
07:38

Author Spotlight: Modular Neuronal Networks for Analyzing Brain Functions

Published on: June 7, 2024

1.6K

Related Experiment Videos

Last Updated: Jul 27, 2025

A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles
06:21

A Simple and Scalable Fabrication Method for Organic Electronic Devices on Textiles

Published on: March 13, 2017

10.5K
Process of Making Three-dimensional Microstructures using Vaporization of a Sacrificial Component
08:31

Process of Making Three-dimensional Microstructures using Vaporization of a Sacrificial Component

Published on: November 2, 2013

9.1K
Author Spotlight: Modular Neuronal Networks for Analyzing Brain Functions
07:38

Author Spotlight: Modular Neuronal Networks for Analyzing Brain Functions

Published on: June 7, 2024

1.6K

Area of Science:

  • Materials Science
  • Electrical Engineering
  • Textile Engineering

Background:

  • Textile-based sensors and actuators are increasingly integrated using conductive yarns.
  • Current limitations exist in directly embedding semiconductor components and control circuits within textiles.
  • Existing methods lack efficient and integrated solutions for connecting surface-mount device (SMD) components to textile substrates.

Purpose of the Study:

  • To develop a novel thermo-compression interconnection technique for seamless integration of SMD components onto textile substrates.
  • To achieve electrical interconnection and encapsulation in a single, cost-effective production step.
  • To enable the fabrication of robust and functional smart textiles with embedded electronics.

Main Methods:

  • Utilized a thermo-compression technique combining 3D printing and heat-press machines for textile applications.
  • Developed a process for directly interconnecting SMD components with functionalized textile substrates.
  • Characterized the electrical properties and encapsulation integrity of the fabricated interconnections.

Main Results:

  • Achieved low electrical resistance with a median value of 21 mΩ for the interconnections.
  • Demonstrated linear voltage-current characteristics, indicating reliable electrical performance.
  • Obtained fluid-resistant encapsulation, enhancing the durability of the textile-electronic interface.
  • Analyzed contact areas and compared them with the theoretical Holm's model.

Conclusions:

  • The novel thermo-compression technique provides an effective solution for integrating electronic components into textiles.
  • The method enables low-resistance, durable, and fluid-resistant electrical interconnections for smart textiles.
  • This approach utilizes cost-effective, widely available equipment, paving the way for scalable smart textile production.