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Light-activated Multilevel Resistive Switching Storage in Pt/Cs2AgBiBr6/ITO/Glass Devices
Tingting Zhong1, Yongfu Qin1, Fengzhen Lv2
1School of Physical Science and Technology and Guangxi Key Laboratory of Nuclear Physics and Technology, Guangxi Normal University, Yucai Road, Guilin, 541000, China.
Nanoscale Research Letters
|December 13, 2021
Summary
High-density Cs2AgBiBr6 films exhibit stable, tristate resistive switching behavior under light irradiation. This discovery offers a promising pathway for developing advanced, high-density memory devices.
Area of Science:
- Materials Science
- Solid-State Physics
- Device Engineering
Background:
- Cesium silver bismuth bromide (Cs2AgBiBr6) is a promising material for optoelectronic applications.
- Resistive switching memory devices offer potential for high-density data storage.
Purpose of the Study:
- To investigate the resistive switching behavior of Cs2AgBiBr6 films under light irradiation.
- To explore the underlying mechanisms responsible for the observed switching characteristics.
- To assess the potential of Cs2AgBiBr6 for high-density memory applications.
Main Methods:
- Fabrication of Cs2AgBiBr6 thin films using a low-temperature sol-gel method.
- Characterization of device performance, including resistance states and stability under illumination.
- Analysis of electrical properties, valence states, and absorption spectra to elucidate switching mechanisms.
Main Results:
- Uniform Cs2AgBiBr6 films were successfully prepared on ITO substrates.
- Stable tristate bipolar resistance switching was observed in Pt/Cs2AgBiBr6/ITO devices under 445 nm light irradiation.
- A high resistance ratio of approximately 500 was achieved, with stable operation over 1200 seconds.
Conclusions:
- The resistive switching is attributed to bromine vacancies and a trap-controlled space charge-limited current mechanism.
- The Schottky-like barrier at the Pt/Cs2AgBiBr6 interface influences the photoelectrical properties and tristate switching.
- Cs2AgBiBr6-based devices show significant potential for developing next-generation high-density memory.
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