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Related Concept Videos

Inductively Coupled Plasma Atomic Emission Spectroscopy: Principle01:19

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Inductively coupled plasma (ICP) is the most widely used plasma source in atomic emission spectroscopy (AES), also known as Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES). The ICP source, or torch, consists of three concentric quartz tubes with argon gas flowing through them. A spark from a Tesla coil initiates the ionization of argon, generating a high-temperature plasma.
The ions and electrons produced interact with the fluctuating magnetic field created by a water-cooled...
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High-throughput deterministic plasma etching using array-type plasma generator system.

Yasuhisa Sano1, Ken Nishida1, Ryohei Asada1

  • 1Division of Precision Engineering and Applied Physics, Graduate School of Engineering, Osaka University, 2-1 Yamada-oka, Suita, Osaka 565-0871, Japan.

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Summary
This summary is machine-generated.

Deterministic processing achieves nanometer accuracy but is slow. This study introduces simultaneous numerically controlled (NC) plasma processing using an array-type plasma generator, significantly improving productivity for high-precision finishing.

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Area of Science:

  • Materials Science
  • Manufacturing Engineering
  • Plasma Physics

Background:

  • Deterministic processing offers nanometer-scale accuracy for high-precision finishing.
  • Current deterministic methods suffer from low productivity due to lengthy surface scanning times.

Purpose of the Study:

  • To develop a more productive method for deterministic processing.
  • To enable simultaneous numerically controlled (NC) plasma processing over the entire work surface.

Main Methods:

  • Utilized an array-type plasma generator with individual on-off control for simultaneous processing.
  • Implemented a novel intermittent gas flow system with cyclic on-off control of valves.
  • Employed pulse-modulated high-frequency power supply and optimized plasma generation time.
  • Developed a power control approach for stable plasma generation across varying array elements.

Main Results:

  • Achieved uniform in-plane plasma etching through intermittent gas flow and short plasma generation times.
  • Demonstrated successful NC plasma etching with reduced thickness variation in a silicon substrate.
  • Showcased the potential for significantly increased productivity in deterministic finishing.

Conclusions:

  • Simultaneous NC plasma processing with an array-type generator offers a viable solution to enhance productivity in deterministic finishing.
  • The developed intermittent gas flow and power control strategies ensure uniform etching and stable plasma conditions.
  • This approach paves the way for faster, high-precision surface finishing applications.