Development of LED Package Heat Dissipation Research
Peisheng Liu1, Chenhui She1, Lipeng Tan1
1Jiangsu Key Laboratory of ASIC Design, School of Information Science and Technology, Nantong University, Nantong 226019, China.
Abstract:
LEDs are widely used in medicine, navigation and landscape lighting. The development of high-power LED is a severe challenge to LED heat dissipation. In this review, packaging technology and packaging structure are reviewed in terms of the thermal performance of LED packaging, and related technologies that promote heat dissipation in LED packaging are introduced. The design of three components to enhance heat dissipation in LED packaging is described: substrate, lens and phosphor layer. By conducting a summary of the technology and structure of the package, the defects of LED package technology and structure are deeply investigated, and the package is prospected. This has reference value for the heat dissipation design of the LED package and helps to improve the design and manufacture of the LED package.
