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Low-crosstalk laser-direct-writing FI/FO device for 8×100-Gbps optical interconnection
Optics Express
|February 25, 2022
Summary
Low crosstalk fan-in/fan-out (FI/FO) devices fabricated using laser-direct-writing enable high-speed optical interconnects. These devices facilitate 8x100-Gbps transmission over 10km multicore fibers with minimal signal degradation.
Area of Science:
- Optical engineering
- Photonics
- Telecommunications
Background:
- Weakly coupled short-reach optical interconnects using multicore fibers (MCF) require low crosstalk fan-in/fan-out (FI/FO) devices.
- Laser-direct-writing (LDW) is a key fabrication technique for these FI/FO devices.
Purpose of the Study:
- To evaluate the impact of FI/FO crosstalk on short-reach intensity-modulation/direction-detection MCF optical interconnections.
- To analyze crosstalk factors related to waveguide refractive-index profiles and misalignment in LDW-FI/FO devices.
- To develop and demonstrate low-crosstalk LDW-FI/FO devices for MCF applications.
Main Methods:
- Analysis of crosstalk in LDW-fabricated FI/FO devices considering refractive-index profiles and misalignment.
- Fabrication of compact LDW-FI/FO devices using a multiple-scan method for flat-top refractive-index profiles and aberration correction for precise alignment.
- Experimental demonstration of an 8x100-Gbps optical interconnection over 10-km MCF.
Main Results:
- Low crosstalk FI/FO devices were fabricated for 8-core MCF.
- An 8x100-Gbps optical interconnection over 10-km MCF was achieved with a low 0.5-dB penalty compared to standard single-mode fiber.
- Simulations suggest potential for transmission over 40 km.
Conclusions:
- The developed low-crosstalk LDW-FI/FO devices are suitable for high-speed optical interconnections.
- The fabricated devices significantly reduce crosstalk, enabling robust MCF-based optical links.
- This technology shows promise for extending the reach and performance of optical interconnects.

