A Dual-Mode 303-Megaframes-per-Second Charge-Domain Time-Compressive Computational CMOS Image Sensor

Area of Science:

• Electrical Engineering
• Computer Vision
• Optics

Background:

• Solid-state image sensors are crucial for high-speed imaging, but current technologies face limitations in frame rates.
• Achieving ultra-high frame rates typically requires complex analog circuitry, increasing power consumption and noise.
• Advanced imaging techniques are needed to capture transient phenomena and improve depth perception.

Purpose of the Study:

• To demonstrate an ultra-high-speed computational CMOS image sensor with a record burst frame rate.
• To enable dual-mode operation (single-event or multi-exposure) for versatile imaging applications.
• To achieve high frame rates with low noise, small pixel size, and reduced power consumption.

Main Methods:

• Developed a CMOS image sensor with a burst frame rate of 303 megaframes per second.
• Implemented temporal compressive sensing directly in the charge domain, eliminating the need for analog circuits.
• Utilized macropixels with 2x2 4-tap subpixels and optimized charge modulator drivers.
• Designed for dual-mode operation: single-event filming and multi-exposure imaging.

Main Results:

• Achieved the fastest solid-state image sensor frame rate to date (303 megaframes per second).
• Demonstrated single-event imaging of plasma emission and multi-exposure transient imaging of light reflections.
• Successfully performed time-of-flight (TOF) depth imaging with an 8x compression ratio, reproducing time-resolved images in a single shot.
• Achieved small pixel size, low noise, and low power consumption.

Conclusions:

• The developed ultra-high-speed CMOS image sensor pushes the boundaries of solid-state imaging capabilities.
• Temporal compressive sensing in the charge domain is an effective method for achieving high frame rates with efficiency.
• The sensor's dual-mode operation and advanced imaging capabilities offer significant potential for scientific and industrial applications, including enhanced depth imaging.