Tailoring Copper-Doped Bioactive Glass/Chitosan Coatings with Angiogenic and Antibacterial Properties

Implant coatings are frequently applied to modulate tissue response and delivery of drugs. Copper (Cu)-containing coatings on dental implant abutments have been proposed to improve soft tissue integration and reduce the risk for peri-implant infections. However, precise control over Cu loading and release kinetics remains a major challenge. In this study, we introduced a bottom-up coating deposition method based on nanoparticle assembly to allow for local release of Cu ions from implant surfaces. We first doped mesoporous bioactive glass (MBG) nanoparticles with various amounts of Cu. Subsequently, we suspended these Cu-doped MBG (Cu-MBG), Cu-free MBG nanoparticles, or mixtures thereof in chitosan solution and prepared a series of composite coatings on commercially pure titanium disks as model surfaces for transmucosal components of bone implants through electrophoretic deposition (EPD). By changing the Cu-MBG:MBG ratio of the composite coatings, we controlled the Cu release kinetics without changing other coating properties. Human gingival fibroblasts proliferated on the composite coatings except for coatings with the highest amount of Cu, which inhibited their proliferation. The migration rate of human umbilical vein endothelial cells cultured on the composite coatings was highest on coatings containing equal amounts of Cu-MBG and Cu-free MBG. Antibacterial tests confirmed that Cu-containing coatings reduced the growth of Porphyromonas gingivalis up to fivefold compared with uncoated implants. In conclusion, our data indicate that the EPD method is suitable to deposit nanoparticle-based coatings onto dental implants, which enhance endothelial cell migration and reduce bacterial growth. Impact statement Precise control over the release of therapeutic agents remains a major challenge for implant coatings. In this study, we introduce a simple and cost-effective way to tune the release of angiogenic and antibacterial copper ions using the electrophoretic deposition technique. Due to the flexibility and mild processing conditions of this technique, our method can also be used to incorporate other therapeutic agents onto implant surfaces.