You might also read
Articles linked to this work by shared authors, journal, and citation graph.
Updated: Sep 24, 2025

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages
Published on: April 13, 2016
Paul Szypryt1, Douglas A Bennett2, William J Boone3
1National Institute of Standards and Technology, Boulder, CO 80305, USA.
This study introduces a new non-destructive 3D imaging method for integrated circuits using scanning electron microscopy (SEM) and transition-edge sensor (TES) x-ray spectroscopy. This technique aids in analyzing complex microelectronic structures and defects.
10:18Dynamic Pore-scale Reservoir-condition Imaging of Reaction in Carbonates Using Synchrotron Fast Tomography
Published on: February 21, 2017
07:48High Spatial Resolution Chemical Imaging of Implant-Associated Infections with X-ray Excited Luminescence Chemical Imaging Through Tissue
Published on: September 30, 2022
Area of Science:
Background:
Purpose of the Study:
Main Methods:
Main Results:
Conclusions: