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Optimized Setup and Protocol for Magnetic Domain Imaging with In Situ Hysteresis Measurement
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Domain Wall Automotion in Three-Dimensional Magnetic Helical Interconnectors.

Luka Skoric1, Claire Donnelly1,2, Aurelio Hierro-Rodriguez3,4

  • 1Department of Physics, Cavendish Laboratory, University of Cambridge, JJ Thomson Ave, Cambridge CB3 0HE, United Kingdom.

ACS Nano
|May 17, 2022
PubMed
Summary
This summary is machine-generated.

Researchers developed a 3D magnetic interconnector using helical conduits to transfer magnetic information. This device utilizes geometry-driven domain wall (DW) automotion, overcoming limitations of current CMOS technologies for future computing.

Keywords:
3D nanofabricationX-ray microscopyautomotiondomain wallsspintronics

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Area of Science:

  • Spintronics and Nanotechnology
  • Materials Science and Engineering

Background:

  • Traditional CMOS technology faces fundamental limits in information processing.
  • Novel approaches for information storage, computation, and transmission are crucial.
  • Exploring beyond CMOS requires innovative materials and device architectures.

Purpose of the Study:

  • To propose and prototype a 3D magnetic interconnector for efficient information transfer.
  • To investigate the mechanism of geometry-driven automotion of magnetic domain walls (DWs) in 3D structures.
  • To demonstrate a pathway for magnetic information transfer in three dimensions.

Main Methods:

  • Fabrication of 3D helical DW conduits using 3D nanoprinting and physical vapor deposition.
  • Experimental observation of DW automotion using X-ray microscopy under varying magnetic fields.
  • Micromagnetic simulations to analyze DW motion mechanisms and energy landscapes.

Main Results:

  • Observed robust, unidirectional automotion of DWs in 3D helical conduits.
  • Identified large thickness gradients as the primary driver for 3D DW automotion.
  • Demonstrated tailorable magnetic energy gradients and their competition with pinning effects.
  • Predicted high DW velocities approaching the Walker limit.

Conclusions:

  • 3D magnetic interconnectors exploiting geometry-driven DW automotion offer a novel approach for information transfer.
  • Thickness gradients in 3D nanostructures are key to controlling DW motion.
  • This technology shows potential for efficient 3D magnetic information transfer, advancing beyond CMOS limitations.