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Cell Patterning on Photolithographically Defined Parylene-C: SiO2 Substrates
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Bonding methods for chip integration with Parylene devices.

James Yoo1, Ellis Meng1,2

  • 1Department of Biomedical Engineering, University of Southern California, Los Angeles, CA, United States of America.

Journal of Micromechanics and Microengineering : Structures, Devices, and Systems
|May 20, 2022
PubMed
Summary
This summary is machine-generated.

Researchers developed new methods for connecting flexible electronics to rigid chips, enabling smaller, high-density interconnects for advanced devices. Polymer ultrasonic on bump (PUB) bonding shows promise for future flexible electronic applications.

Keywords:
ACFASIC integrationPUB bondingParylene Cconductive epoxypolymer interconnectwire bonding

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Nanotechnology

Background:

  • Flexible electronics demand miniaturized interconnects for advanced device integration.
  • Bonding flexible polymer devices to rigid integrated circuit chips presents significant technical hurdles.
  • Current bonding technologies often lack the required density or involve complex, specialized processes.

Purpose of the Study:

  • To adapt and evaluate existing bonding techniques for fine-pitch interconnects between rigid and flexible substrates.
  • To introduce and investigate a novel bonding method: polymer ultrasonic on bump (PUB) bonding.
  • To assess the performance and reliability of different bonding methods using Parylene C devices.

Main Methods:

  • Adaptation of epoxy, ultrasonic wire, and anisotropic conductive film bonding techniques.
  • Development and application of a novel polymer ultrasonic on bump (PUB) bonding method.
  • Systematic investigation of four bonding methods on various rigid substrates with different bond pad sizes and pitches, using Parylene C devices.

Main Results:

  • All investigated methods successfully achieved fine-pitch interconnects (100 μm) at low temperatures (<100 °C).
  • Performance was evaluated through yield, resistance measurements, and thermomechanical reliability testing.
  • The novel PUB bonding technique was demonstrated for joining packaged chips and bare dies to Parylene devices.

Conclusions:

  • Multiple bonding strategies can achieve fine-pitch interconnects for flexible electronics at low temperatures.
  • Polymer ultrasonic on bump (PUB) bonding offers a promising new approach for integrating flexible and rigid components.
  • The study provides valuable insights into selecting and optimizing bonding methods for next-generation flexible electronic devices.