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Large-scale and high-depth three dimensional scanning measurement system and algorithm optimization.
Fan Zhang1, ZhenYang Li1, Liansheng Zhang1
1School of Instrument Science and Opto-electronic Engineering, Hefei University of Technology, Hefei 230009, China.
The Review of Scientific Instruments
|June 1, 2022
Summary
This study introduces a new 3D scanning system using a quartz tuning fork and tungsten stylus for high-resolution surface topography measurement. A novel sliding window algorithm improves accuracy and efficiency for microstructures.
Area of Science:
- Nanotechnology
- Surface Metrology
- Microdevice Characterization
Background:
- Tapping scanning mode is crucial for nanometer-scale surface topography measurement, offering reduced sample damage and lateral force elimination.
- Existing scanning probe microscopes have limitations in measurement range and Z-direction ability, hindering the study of high aspect ratio microstructures.
- There is a significant need for advanced 3D scanning technologies with large ranges and high depth-to-width ratios for practical engineering applications.
Purpose of the Study:
- To develop a novel 3D scanning measurement system capable of high-resolution topography measurement of microdevices with large aspect ratios.
- To enhance scanning efficiency and accuracy using a new sliding window algorithm (SWA).
- To provide a reliable method for characterizing microfluidic biochips and other microstructures.
Main Methods:
- Utilized a quartz tuning fork with high-frequency resonance and a tungsten stylus for the scanning probe.
- Developed a 3D scanning measurement system with a total measuring range of 400 × 400 × 400 µm³ and a vertical resolution of 0.28 nm.
- Implemented a sliding window algorithm (SWA) to address scanning errors and improve efficiency compared to traditional point-by-line methods.
Main Results:
- Achieved microstructure measurement with a depth of approximately 58 µm.
- The system accurately captured the 3D surface topography of a microfluidic biochip.
- The proposed SWA reduced the mean squared residuals of the 3D profile by 7.70% compared to the point-by-line scanning algorithm.
Conclusions:
- The developed 3D scanning measurement system effectively measures the 3D surface topography of microstructures with large aspect ratios.
- The sliding window algorithm demonstrates improved accuracy and efficiency in scanning processes.
- This technology offers a valuable reference for 3D topography measurements in microdevice characterization.
