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Using Laser Scanning Microscopy to Determine Electromigration in Molybdenum Disilicide
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Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit Interconnects.

Wen-Sheng Zhao1, Rui Zhang2, Da-Wei Wang1

  • 1Zhejiang Provincial Key Lab of Large-Scale Integrated Circuit Design, School of Electronics and Information, Hangzhou Dianzi University, Hangzhou 310018, China.

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Summary

This paper reviews physics-based modeling for electromigration, a key aging mechanism in advanced integrated circuits. Understanding electromigration is vital for designing reliable and sustainable electronic systems.

Keywords:
agingelectromigrationintegrated circuit interconnectsphysics-based modelingreliability

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Area of Science:

  • Electrical Engineering
  • Materials Science
  • Computer Engineering

Background:

  • Semiconductor technology advances increase integrated circuit density and performance.
  • Advanced integrated circuits are more vulnerable to aging mechanisms from front-end to back-end processes.
  • Electromigration is a critical back-end aging mechanism impacting interconnect reliability.

Purpose of the Study:

  • To review recent studies on physics-based modeling of electromigration aging in on-chip interconnects.
  • To provide a comprehensive overview of electromigration modeling methodologies and their applications.
  • To highlight the importance of electromigration analysis for reliable and sustainable electronic systems.

Main Methods:

  • Introduction to the background and conventional methods of electromigration.
  • Description of physics-based modeling approaches for electromigration.
  • Discussion of studies on electromigration's impact on power grids and signal interconnects.

Main Results:

  • Physics-based modeling offers a more accurate approach to understanding electromigration compared to conventional methods.
  • Electromigration significantly affects the reliability of both power grids and signal interconnects in integrated circuits.
  • Research has focused on improving modeling comprehensiveness, computational efficiency, and aging acceleration/deceleration strategies.

Conclusions:

  • Physics-based modeling of electromigration is essential for ensuring the reliability of advanced integrated circuits.
  • Effective modeling strategies are crucial for designing sustainable electronic systems at advanced technology nodes.
  • Further research into electromigration modeling will enhance the longevity and performance of integrated circuits.