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Delayed light activation of resin composite affects the bond strength of adhesives under dynamic simulated pulpal
Nattaporn Sukprasert1, Choltacha Harnirattisai1, Pisol Senawongse1
1Department of Operative Dentistry and Endodontics, Faculty of Dentistry, Mahidol University, Ratchathewi District, No. 6, Yothi Road, Bangkok, 10400, Thailand.
Objective:
To evaluate the effect of a time delay before the light activation of resin composite on the microtensile bond strength (µTBS) of self-etch adhesives under dynamic simulated pulpal pressure.
Materials And Methods:
One hundred twenty crown segments were prepared from human third molars. Dentin surfaces were prepared with coarse diamond burs and connected to a dynamic pulpal pressure device. The self-etch adhesives used were Clearfil SE Bond (CSE), G2-Bond Universal (G2B), Clearfil Universal Bond Quick (CBQ), and G-Premio Bond (GPB). Each adhesive was divided into 3 subgroups: immediate light activation of resin composite (T0), delayed light activation for 150 s (T1), and 300 s (T2). The µTBS data were obtained after 24-h water storage. Scanning electron microscopy was used to evaluate the nanoleakage at the resin-dentin surface. The µTBS data were analyzed using two-way ANOVA and Duncan's multiple comparisons.
Results:
All adhesives demonstrated a significant reduction in µTBS at T2, except for CBQ where the bond strength was not affected by the delayed light activation times. The two-step self-etch adhesives (CSE and G2B) demonstrated higher bond strength than the one-step adhesives at all conditions. Nanoleakage was observed in all adhesives at T2; however, nanoleakage was detected only in CBQ and GPB at T1.
Conclusions:
Delayed light activation of resin composite adversely affected the dentin bond strength of self-etch adhesives. Two-step self-etch adhesives had better bonding performance than one-step self-etch adhesives.
Clinical Relevance:
After adhesive application, resin composite should be adapted and cured as soon as possible.
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