Built-In Packaging for Single Terminal Devices.

Area of Science:

• Micro-electro-mechanical systems (MEMS)
• Packaging technology
• Actuator devices

Background:

• Conventional packaging for single terminal devices often requires complex components such as wire bonding, chip carriers, and printed circuit boards (PCBs).
• These traditional methods can introduce noise and increase operational complexity.
• There is a need for simplified and cost-effective packaging solutions, especially for micro-scale devices.

Purpose of the Study:

• To propose and demonstrate an alternative packaging method, termed built-in packaging, for single terminal devices.
• To evaluate the performance of built-in packaging using a micro resonator actuator.
• To assess the feasibility of built-in packaging for industrial and academic applications.

Main Methods:

• Developed a built-in packaging technique that eliminates the need for wire bonding, chip carriers, PCBs, probe stations, and interconnection elements.
• Fabricated a micro resonator device.
• Packaged the micro resonator using the built-in method and performed electrostatic actuation with optical measurement for performance analysis.

Main Results:

• The built-in packaging method successfully demonstrated electrostatic actuation and optical measurement of a micro resonator.
• Actuation performance achieved with built-in packaging was identical to that of the conventional wire bonding method.
• The proposed method significantly reduces the number of required components, simplifying operation and minimizing noise sources.

Conclusions:

• Built-in packaging is a viable and effective alternative for single terminal devices, particularly micro resonators.
• This method provides a compact, cost-effective, and simplified packaging solution.
• The technology holds promise for widespread adoption in both industrial and academic settings due to its performance and economic advantages.