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Updated: Aug 28, 2025

Methods of Ex Situ and In Situ Investigations of Structural Transformations: The Case of Crystallization of Metallic Glasses
Published on: June 7, 2018
Thermal Expansion of 3C-SiC Obtained from In-Situ X-ray Diffraction at High Temperature and First-Principal
N M Sultan1, Thar M Badri Albarody1, Husam Kareem Mohsin Al-Jothery2
1Department of Mechanical Engineering, Universiti Teknologi PETRONAS (UTP), Bandar Seri Iskandar 32610, Malaysia.
This study determined the thermal expansion of beta silicon carbide (3C-SiC) using experimental and computational methods. Results show a temperature-dependent expansion, crucial for material applications.
Area of Science:
- Materials Science
- Solid State Physics
- Crystallography
Background:
- Beta silicon carbide (3C-SiC) is a critical semiconductor material.
- Understanding its thermal expansion is vital for high-temperature applications.
- Accurate thermal expansion data is needed for material design and performance prediction.
Purpose of the Study:
- To experimentally determine the coefficient of thermal expansion (CTE) of 3C-SiC.
- To computationally validate the CTE using density functional theory.
- To establish a comprehensive understanding of 3C-SiC's thermal behavior.
Main Methods:
- In situ X-ray crystallography powder diffraction was used to study 3C-SiC from 25-800 °C.
- CASTEP codes and density functional theory calculated phonon frequencies at various pressures.
- The Gruneisen formalism was applied for computational CTE determination.
Main Results:
- At 25 °C, the lattice parameter of 3C-SiC was 4.596 Å, with a CTE of 2.4 ×10⁻⁶/°C.
- The experimental CTE followed a second-order polynomial relationship with temperature.
- Computational methods yielded a CTE of 2.2 ×10⁻⁶/°C, consistent with experimental findings.
Conclusions:
- This research presents a novel two-step approach to determine 3C-SiC's thermal expansion.
- Both experimental and computational results provide reliable data for material scientists.
- The findings enhance the understanding of 3C-SiC's behavior under thermal stress.
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