High Quality Pt-Pt Metal Bonding for High Temperature Packaging
Jiazheng Liu1,2, Junqiang Wang1,2, Mengwei Li1,2
1Academy for Advanced Interdisciplinary Research, North University of China, Taiyuan 030051, China.
Micromachines
|September 23, 2022
Summary
Platinum-to-platinum thermocompression bonding was achieved for high-temperature device packaging. This method yields robust interconnections with high shear resistance and low leakage rates, suitable for demanding applications.
Area of Science:
- Materials Science
- Electrical Engineering
- Semiconductor Manufacturing
Background:
- Platinum (Pt) offers excellent high-temperature resistance and electrical properties, making it suitable for advanced device packaging.
- Reliable interconnection methods are crucial for high-temperature resistant devices, but traditional methods face limitations.
Purpose of the Study:
- To explore and optimize thermocompression bonding processes for Platinum-to-Platinum (Pt-Pt) metal electrodes.
- To achieve robust package interconnections meeting stringent requirements for high-temperature applications.
Main Methods:
- Fabrication of square Pt bumps (160 µm) and sealing rings (80 µm) using magnetron sputtering.
- Optimization of chip-level thermocompression bonding parameters, including temperature (350 °C) and pressure (100 MPa) for 20 minutes.
- Interface analysis using scanning electron microscopy (SEM) to observe Cr diffusion into Pt.
Main Results:
- Successful Pt-Pt thermocompression bonding achieved, forming reliable package interconnections.
- Achieved shear resistance up to 30 MPa for chips bonded at 350 °C and 100 MPa.
- Demonstrated a low leakage rate (< 2 × 10⁻³ Pa·cm³/s) and a smooth bonding interface.
Conclusions:
- Optimized process parameters enable high-quality hot-pressed metal bonding of Pt electrodes.
- The developed Pt-Pt bonding technique provides a viable solution for packaging high-temperature resistant devices.
- This study offers new methodologies for advancing high-temperature device packaging technologies.
