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Published on: January 19, 2016
Thermo-Mechanical Behavior of Novel EPDM Foams Containing a Phase Change Material for Thermal Energy Storage
Marica Bianchi1, Francesco Valentini1, Giulia Fredi1
1INSTM Research Unit, Department of Industrial Engineering, University of Trento, Via Sommarive 9, 38123 Trento, Italy.
Abstract:
In this paper Ethylene Propylene Diene Monomer rubber (EPDM) foams were filled with different amounts of paraffin, a common phase change material (PCM) having a melting temperature at about 70 °C, to develop novel rubber foams with thermal energy storage (TES) capabilities. Samples were prepared by melt compounding and hot pressing, and the effects of three foaming methods were investigated. In particular, two series of samples were produced through conventional foaming techniques, involving physical (Micropearl® F82, MP, Lehvoss Italia s.r.l. Saronno, Italia) and chemical (Hostatron® P0168, H, Clariant GmbH, Ahrensburg, Germany) blowing agents, while the salt leaching method was adopted to produce another series of foams. Scanning electron microscopy (SEM) and density measurements showed that MP led to the formation of a closed-cell porosity, while a mixed closed-cell/open-cell morphology was detected for the H foamed samples. On the other hand, foams produced through salt leaching were mainly characterized by an open-cell porosity. The qualitative analysis of paraffin leakage revealed that at 90 °C only the foams produced through salt leaching suffered from significant PCM leakage. Consequently, the thermo-mechanical properties were investigated only in samples produced with H and MP. Differential Scanning Calorimetry (DSC) analysis revealed that EPDM/paraffin foams were endowed by good TES properties, especially at higher PCM contents (up to 145 J/g with a paraffin amount of 60 wt%). Tensile and compressive tests demonstrated the addition of the PCM increased the stiffness at 25 °C, while the opposite effect was observed above the melting temperature of paraffin. These results suggest that the EPDM foams produced with H and MP show an interesting potential for thermal management of electronic devices.
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