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Related Concept Videos

Fatigue01:21

Fatigue

226
Fatigue occurs when materials rupture under repeated or fluctuating loads, even at stress levels far below their static breaking strength. It typically results in brittle failure, even for ductile materials. It is a critical consideration in designing machines and structural components subjected to repetitive or varying loads. The nature of these loadings can range from fluctuating loads like unbalanced pump impellers causing vibrations to repeatedly bending a thin steel rod wire back and forth...
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Thermal Stress01:09

Thermal Stress

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If the temperature of an object is changed while it is prevented from expanding or contracting, the object is subjected to stress. The stress is compressive if the object expands in the absence of constraint and tensile if it contracts. This stress resulting from temperature change is known as thermal stress. It can be quite large and can cause damage. To avoid this stress, engineers may design components so they can expand and contract freely. For instance, on highways, gaps are deliberately...
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Thermal expansion and Thermal stress: Problem Solving01:27

Thermal expansion and Thermal stress: Problem Solving

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San Francisco's Golden Gate Bridge is exposed to temperatures ranging from -15 °C to 40 °C. At its coldest, the main span of the bridge is 1275 m long. Assuming that the bridge is made entirely of steel, what is the change in its length between these temperatures?
To solve the problem, first, identify the known and unknown quantities. The initial length (L) of the bridge is 1275 m, the coefficient of linear expansion (α) for steel is 12 x 10-6/°C, and the change in...
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Test Structure Design for Defect Detection during Active Thermal Cycling.

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  • 1Infineon Technologies Romania & Co. SCS, 020335 Bucharest, Romania.

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Summary
This summary is machine-generated.

This study introduces a novel test structure with integrated sensors to assess metallization fatigue in smart power switches. The sensors effectively monitor electro-thermal behavior, aiding in defect detection and preventing failures in power integrated circuits.

Keywords:
DMOS power transistoractive thermal cyclingelectro-thermalfailure mechanismsintegrated sensorsmetallization fatiguesmart power ICtest structurethermo-mechanical

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Area of Science:

  • Electrical Engineering
  • Materials Science
  • Semiconductor Physics

Background:

  • Integrated power ICs are crucial for automotive and industrial applications.
  • These devices experience thermal cycling, leading to self-heating and potential metallization fatigue.
  • Electro-thermo-mechanical phenomena contribute to failure mechanisms in device metallization.

Purpose of the Study:

  • To propose and evaluate a test structure for assessing metallization fatigue in power ICs.
  • To investigate the use of integrated sensors for monitoring device health.
  • To correlate experimental data with electro-thermal simulations for failure analysis.

Main Methods:

  • Design of a lateral DMOS transistor test structure with integrated sensors.
  • Detailed presentation of design considerations from literature and simulations.
  • Description of the testing procedure and experimental data collection.
  • Correlation of sensor data with electro-thermal simulation results.

Main Results:

  • Integrated sensors provided experimental data on device behavior under thermal cycling.
  • Correlation between sensor data and simulation results indicated an emerging failure mechanism.
  • Failure analysis confirmed the identified failure mechanism.
  • Demonstrated feasibility of using integrated sensors for defect monitoring.

Conclusions:

  • The proposed test structure and integrated sensors are effective for metallization fatigue assessment.
  • Integrated sensors offer a viable method for in-situ monitoring of defects in power ICs.
  • This approach can enhance the reliability and longevity of smart power switches.