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Related Experiment Video

Updated: Aug 23, 2025

Assembly and Characterization of Biomolecular Memristors Consisting of Ion Channel-doped Lipid Membranes

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Published on: March 9, 2019

Using Chiplet Encapsulation Technology to Achieve Processing-in-Memory Functions.

Wenchao Tian¹, Bin Li¹, Zhao Li¹

¹School of Electro-Mechnical Engineering, Xidian University, Xi'an 710000, China.

|October 27, 2022

Summary

This summary is machine-generated.

Processing-in-memory (PIM) technology using advanced chiplet packaging addresses the "storage wall" bottleneck. Chiplet designs, including 2.5D, 3D, and fan-out, enhance data processing for AI and 5G systems.

Keywords:

2.5D 3D packaging Chiplet Von Neumann structure processing-in-memory

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Area of Science:

Computer Engineering
Materials Science
Electrical Engineering

Background:

The proliferation of 5G, AI, and HPC drives exponential data growth, exacerbating the
storage wall
limitation inherent in the von Neumann architecture.
This bottleneck severely restricts system computational performance, necessitating novel solutions.

Purpose of the Study:

To review and analyze recent advancements in chiplet packaging technologies enabling processing-in-memory (PIM).
To summarize the research status, development directions, and application outcomes of PIM through chiplet integration.

Main Methods:

Categorization of PIM-enabled chiplet packaging into 2.5D, 3D, and fan-out approaches.
Analysis of the physical forms, characteristics, and PIM implementation strategies for each packaging type.
Review of recent research and application results in the PIM chiplet domain.

Main Results:

Chiplet integration with advanced packaging (2.5D, 3D, fan-out) effectively mitigates the
storage wall
issue.
These chiplet-based PIM solutions enhance signal transmission quality and bandwidth.
Demonstrated improvements in processing large data volumes for demanding applications.

Conclusions:

Chiplet packaging is a viable and effective strategy for realizing PIM, crucial for overcoming data bottlenecks.
Future development of chiplets holds significant promise for advancing PIM technology and high-performance computing.