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Using Chiplet Encapsulation Technology to Achieve Processing-in-Memory Functions

Wenchao Tian1, Bin Li1, Zhao Li1

  • 1School of Electro-Mechnical Engineering, Xidian University, Xi'an 710000, China.

Micromachines
|October 27, 2022
PubMed

Keywords:
2.5D3D packagingChipletVon Neumann structureprocessing-in-memory

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