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CoSn3 Intermetallic Nanoparticles for Electronic Packaging.

Jintao Wang1,2,3, Ziwen Lv1,2,3, Luobin Zhang1,2,3

  • 1Department of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China.

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|November 26, 2022
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Summary
This summary is machine-generated.

A new chemical synthesis method produces cobalt-tin (CoSn3) nanoparticles, crucial for strengthening tin-based composite solder pastes used in electronic packaging. This advancement offers a reliable path for creating enhanced soldering materials.

Keywords:
CoSn3 nanoparticlesTEMchemical reductionintermetallicsolder

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Solid-State Chemistry

Background:

  • Composite solder pastes, particularly tin (Sn)-based solders reinforced with nanoparticles, are gaining attention for electronic packaging.
  • Cobalt-tin (CoSn3) is identified as a potent nucleating agent for Sn crystals, yet a reliable synthesis route for CoSn3 nanoparticles is currently lacking.

Purpose of the Study:

  • To develop a reliable chemical synthesis method for producing cobalt-tin (CoSn3) nanoparticles.
  • To investigate the synthesis, growth mechanisms, and application of CoSn3 nanoparticles in composite solder pastes.

Main Methods:

  • Chemical reduction of cobalt chloride (CoCl2) and tin chloride (SnCl2) using sodium borohydride (NaHB4) in triethylene glycol (TEG).
  • Ultrasonic dispersion and thermal treatment at 350 °C in a tube furnace for nanoparticle growth.
  • Characterization of nanoparticle size, crystal growth behavior, and nucleation/growth mechanisms (OU and OA).

Main Results:

  • Successfully synthesized CoSn3 nanoparticles with an average diameter of approximately 150 nm by heating at 350 °C for 10 minutes.
  • Observed step-wise reactions, merging, and annexation during nanoparticle synthesis and growth.
  • Identified two primary growth mechanisms: orientation unified (OU) and orientation attached (OA).
  • Developed a strengthened composite soldering paste by incorporating CoSn3 nanoparticles into SAC305, exhibiting six-fold cyclic twins in solder joints.

Conclusions:

  • A viable chemical synthesis pathway for CoSn3 nanoparticles has been established.
  • The synthesized CoSn3 nanoparticles effectively enhance the properties of SAC305 composite solder paste.
  • The resulting solder joints demonstrate unique microstructural features, such as six-fold cyclic twins, indicating improved performance potential.