Use of Chipless RFID as a Passive, Printable Sensor Technology for Aerospace Strain and Temperature Monitoring

This paper was concerned with the current level of progress towards the development of chipless radio frequency identification (RFID) sensors that are capable of sensing strain and temperature. More specifically, it was interested in the possibility that the resulting devices could be used as a passive wireless structural health monitoring (SHM) sensor technology that could be printed in situ. This work contains the development and performance characterization results for both novel strain and novel temperature sensor designs with resulting sensitivities of 9.77 MHz/%ε and 0.88 MHz/°C, respectively. Furthermore, a detailed discussion on the interrogation system required to meet the relevant aerospace sensing requirements was also discussed, and several methods were explored to enhance the multi-sensor support capabilities of this technology.