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Related Concept Videos

Biasing of Metal-Semiconductor Junctions01:27

Biasing of Metal-Semiconductor Junctions

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Biasing metal-semiconductor junctions involves applying a voltage across the junction. Specifically, the metal is connected to a voltage source, while the semiconductor is grounded. This technique is essential for controlling the direction and magnitude of current flow in electronic devices, including diodes, transistors, and photovoltaic cells.
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
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Characteristics of MOSFET01:17

Characteristics of MOSFET

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Metal-oxide-semiconductor field-effect Transistors, or MOSFETs, play a critical role in electronic circuits. They are primarily utilized for amplifying and switching signals.
Various vital parameters influence their functionality, which is crucial for theory and electronics applications. First, channel dimensions, precisely length, and width, are pivotal. The size of these channels affects the transistor's ability to carry current and switching speeds; shorter channels typically enable...
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Biasing of FET01:22

Biasing of FET

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Biasing a Junction Field Effect Transistor (JFET) is crucial for setting operational parameters and ensuring efficient functioning in electronic circuits. JFETs are characterized by using a single carrier type in N-channel or P-channel configurations, where the channel is surrounded by PN junctions. These junctions are central to the device's ability to control current flow.
In an N-channel JFET, the structure consists of N-type material forming the channel on a P-type substrate, with the...
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Biasing of P-N Junction01:16

Biasing of P-N Junction

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The operation of a p-n junction diode involves various biasing conditions, including forward bias, reverse bias, and equilibrium.
In equilibrium, no external voltage is applied across the p-n junction. The depletion region is formed at the junction interface due to the diffusion of carriers, which leaves behind charged dopants, acceptors on the p-side, and donors on the n-side. These immobile charges create an electric field that prevents further diffusion of carriers. The related energy band...
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Metal-Semiconductor Junctions01:24

Metal-Semiconductor Junctions

429
The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
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MOSFET: Depletion Mode01:20

MOSFET: Depletion Mode

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Depletion-mode MOSFETs represent a unique subset of MOSFET technology, functioning fundamentally differently from their enhancement-mode counterparts. Unlike enhancement MOSFETs, which require a positive gate-source voltage (Vgs) to turn on, depletion-mode MOSFETs are inherently conductive and "normally on" devices.
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Updated: Aug 16, 2025

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Buffer Traps Effect on GaN-on-Si High-Electron-Mobility Transistor at Different Substrate Voltages.

Yuan Lin1, Min-Lu Kao1, You-Chen Weng2

  • 1Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.

Micromachines
|December 23, 2022
PubMed
Summary

Investigating substrate voltage (VSUB) in Gallium Nitride on Silicon (GaN-on-Si) high electron mobility transistors (HEMTs) reveals its impact on device performance. Applying specific VSUB levels can enhance breakdown voltage and dynamic on-resistance by managing charge traps.

Keywords:
GaNHEMTbreakdown voltagecharge redistributiondonor trapdynamic on-resistancesubstrate voltage

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Area of Science:

  • Materials Science
  • Semiconductor Physics
  • Electrical Engineering

Background:

  • Gallium Nitride on Silicon (GaN-on-Si) high electron mobility transistors (HEMTs) are crucial for power applications.
  • Substrate voltage (VSUB) influences the behavior of traps within the buffer stack and their effect on 2DEG conductivity.
  • Understanding trap dynamics is essential for optimizing GaN-on-Si HEMT performance.

Purpose of the Study:

  • To investigate the effects of substrate voltage (VSUB) on GaN-on-Si HEMTs with superlattice transition layers.
  • To analyze how VSUB impacts 2DEG conductivity, buffer charge redistribution, and trap ionization.
  • To determine the relationship between VSUB and key performance metrics like breakdown voltage (BV) and dynamic on-resistance (Ron).

Main Methods:

  • Experimental investigation of GaN-on-Si HEMTs with superlattice transition layers.
  • Application of varying substrate voltages (VSUB) to the devices.
  • Analysis of 2-dimensional electron gas (2DEG) conductivity, charge redistribution, and trap behavior.

Main Results:

  • Negative VSUB increases ionized donor and acceptor traps, enhancing breakdown voltage (BV) by improving vertical electric field distribution.
  • Positive VSUB aids in refilling ionized traps, leading to a slight improvement in dynamic on-resistance (Ron) degradation.
  • Asymmetric electron injection into the buffer stack layer is observed, influenced by VSUB.

Conclusions:

  • Substrate voltage (VSUB) significantly modulates the electrical performance of GaN-on-Si HEMTs through field effect and buffer trapping.
  • Optimizing VSUB is critical for enhancing breakdown voltage and dynamic on-resistance in power applications.
  • The study highlights the complex interplay between VSUB, trap dynamics, and charge redistribution in GaN-on-Si HEMTs.