On the "intrinsic" breakdown of thick gate oxide

The thick gate oxide breakdown mechanism has become an important topic again due to the rising demand for power electronics. The failure of the percolation model in explaining the observed Weibull shape factor, β, seriously hampers the establishment of thick gate oxide breakdown models and the ability to project reliability from measurement data. In this work, lifetime shortening by oxide defects are simulated to produce degraded breakdown distributions that match experimentally observed βs. The result shows that even a low density of defects with the right energy is enough to greatly degrade β for thick oxides. Strong area scaling for thin oxides counters this sensitivity to defects effectively and explains why the percolation model is successful in thin oxides but not in thick oxides. Only defects with the appropriate energy can degrade the breakdown distribution. The required energy is consistent with oxygen vacancy $E_{\gamma }^{\text{'}}$ defect after capturing a hole and the concentration required is consistent with very high-quality oxide. This explains the consistent low β values for thick oxides universally reported in the literature.