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Updated: Aug 14, 2025

Author Spotlight: Simulation and Analysis of the Temperature Rise of Ring Main Unit Equipment
Published on: July 5, 2024
Techno-economic feasibility analysis of an extreme heat flux micro-cooler
Ercan M Dede1, Chi Zhang2,3, Qianying Wu2
1Electronics Research Department, Toyota Research Institute of North America, Ann Arbor, MI, USA.
Abstract:
An estimated 70% of the electricity in the United States currently passes through power conversion electronics, and this percentage is projected to increase eventually to up to 100%. At a global scale, wide adoption of highly efficient power electronics technologies is thus anticipated to have a major impact on worldwide energy consumption. As described in this perspective, for power conversion, outstanding thermal management for semiconductor devices is one key to unlocking this potentially massive energy savings. Integrated microscale cooling has been positively identified for such thermal management of future high-heat-flux, i.e., 1 kW/cm2, wide-bandgap (WBG) semiconductor devices. In this work, we connect this advanced cooling approach to the energy impact of using WBG devices and further present a techno-economic analysis to clarify the projected status of performance, manufacturing approaches, fabrication costs, and remaining barriers to the adoption of such cooling technology.
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