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High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
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Editorial for the Special Issue on Advanced Interconnect and Packaging
1Zhejiang Provincial Key Lab of Large-Scale Integrated Circuit Design, School of Electronics and Information, Hangzhou Dianzi University, Hangzhou 310018, China.
Micromachines
|January 21, 2023
Abstract:
Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation [...].
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