Related Experiment Video

Updated: Jun 25, 2025

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
07:51

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

7.4K

Editorial for the Special Issue on Advanced Interconnect and Packaging, 2nd Edition

Dawei Wang1, Wensheng Zhao1

  • 1School of Electronics and Information and School of Integrated Circuit Science and Engineering, Hangzhou Dianzi University, Hangzhou 310018, China.

Micromachines
|May 25, 2024
PubMed

More Related Videos

Design, Surface Treatment, Cellular Plating, and Culturing of Modular Neuronal Networks Composed of Functionally Inter-connected Circuits10:32

Design, Surface Treatment, Cellular Plating, and Culturing of Modular Neuronal Networks Composed of Functionally Inter-connected Circuits

Published on: April 15, 2015

8.5K
PDMS Device Fabrication and Surface Modification14:48

PDMS Device Fabrication and Surface Modification

Published on: October 1, 2007

14.8K

Related Concept Videos