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Liquid-Modulated Photothermal Phenomena in Porous Silicon Nanostructures Studied by μ-Raman Spectroscopy.

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Filling nanoporous silicon with hexadecane liquid enhances thermal conductivity and suppresses laser-induced phase transitions. This study explores thermal transport in porous silicon composites.

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liquid-confined nanoporesphotothermal phenomenaporous silicon-liquid compositesilicon nanostructuresthermal conductivityμ-Raman spectroscopy

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Thermal Engineering

Background:

  • Porous silicon (p-Si) exhibits unique thermal properties due to its nanostructure.
  • Understanding thermal transport in p-Si is crucial for thermal management applications.
  • The influence of pore filling on thermal conductivity and phase transitions is not fully understood.

Purpose of the Study:

  • To investigate the effect of liquid hexadecane filling on the thermal transport properties of porous silicon.
  • To quantify the changes in thermal conductivity of porous silicon-hexadecane composites.
  • To examine the impact of pore filling on laser-induced phase transitions in silicon.

Main Methods:

  • Utilizing micro-Raman spectroscopy to probe thermal effects.
  • Employing finite element method (FEM) simulations to model thermal transport.
  • Correlating experimentally measured photoinduced temperature rise with simulation data.

Main Results:

  • Liquid hexadecane filling significantly increased the thermal conductivity of porous silicon across a wide porosity range (40-80%).
  • Pore filling suppressed the characteristic laser-induced phase transition of silicon from cubic to hexagonal.
  • The study provides quantitative data on thermal conductivity enhancement in porous silicon composites.

Conclusions:

  • Liquid infiltration is an effective strategy to enhance the thermal conductivity of porous silicon.
  • Hexadecane filling modifies the thermal and structural response of porous silicon to laser irradiation.
  • These findings have implications for designing advanced thermal management materials and devices.