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A Hierarchically Structured Graphene/Ag Nanowires Paper as Thermal Interface Material.
Le Lv1,2, Junfeng Ying1,2, Lu Chen1,2
1Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo 315201, China.
Nanomaterials (Basel, Switzerland)
|March 11, 2023
Summary
Researchers developed an improved graphene paper using silver nanowires (AgNWs) for enhanced heat dissipation in electronics. This novel thermal interface material (TIM) significantly boosts through-plane thermal conductivity, outperforming commercial options.
Area of Science:
- Materials Science
- Nanotechnology
- Electronics Engineering
Background:
- Modern electronics face thermal management challenges due to increasing heat power density.
- Graphene-based thermal interface materials (TIMs) are promising due to graphene's high thermal conductivity.
- Existing graphene papers struggle with efficient through-plane heat transfer.
Purpose of the Study:
- To develop a high-performance graphene-based TIM with enhanced through-plane thermal conductivity.
- To address the limitations of current graphene papers in heat dissipation applications.
- To create a novel material for next-generation electronic thermal management.
Main Methods:
- In situ deposition of silver nanowires (AgNWs) onto graphene sheets to create IGAP.
- Characterization of the structural and thermal properties of the developed material.
- Performance testing of IGAP as a TIM under simulated and actual operating conditions.
Main Results:
- Achieved a through-plane thermal conductivity of 7.48 W m-1 K-1 for the IGAP under packaging conditions.
- Demonstrated significantly enhanced heat dissipation performance compared to commercial thermal pads.
- Validated the effectiveness of AgNWs in improving through-plane thermal transport in graphene papers.
Conclusions:
- The novel IGAP material offers a viable solution for efficient heat dissipation in high-power electronics.
- This approach effectively enhances the through-plane thermal conductivity of graphene-based TIMs.
- IGAP shows great potential for advancing thermal management in next-generation integrated circuit electronics.
