Excellent Energy Storage Performance in Epoxy Resin Dielectric Polymer Films by a Facile Hot-Pressing Method

Area of Science:

• Materials Science
• Polymer Chemistry
• Electrical Engineering

Background:

• Epoxy resins (EP) are vital dielectric polymers in electronics due to their stability and insulating properties.
• Complex EP preparation hinders their use in energy storage applications.
• Developing efficient fabrication methods for high-performance EP is crucial.

Purpose of the Study:

• To fabricate thin bisphenol F epoxy resin (EPF) films using a facile hot-pressing method.
• To investigate the impact of the monomer/curing agent ratio on EPF properties.
• To enhance the energy storage performance of EPF films.

Main Methods:

• Bisphenol F epoxy resin (EPF) films fabricated via hot-pressing (10–15 μm thickness).
• Systematic variation of EP monomer/curing agent ratios.
• Characterization of dielectric properties, breakdown strength, and energy storage performance.

Main Results:

• Hot-pressing successfully produced thin EPF films.
• Curing degree, breakdown strength, and energy storage were strongly influenced by the monomer/curing agent ratio.
• An EPF film (ratio 1:1.5) achieved 6.5 J·cm^-3 discharged energy density and 86% efficiency at 600 MV·m^-1.

Conclusions:

• The hot-pressing method is effective for producing high-quality EPF films.
• Optimized EPF films exhibit excellent energy storage capabilities for pulse power capacitors.
• This approach offers a facile route to advanced dielectric materials for energy storage.