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Published on: August 5, 2020
Polyimide-On-Silicon 2D Piezoelectric Micromachined Ultrasound Transducer (PMUT) Array
Sanjog Vilas Joshi1, Sina Sadeghpour1, Michael Kraft1,2
1Department of Electrical Engineering (ESAT-MNS), KU Leuven, 3000 Leuven, Belgium.
This study introduces a low-cost 8x8 piezoelectric micromachined ultrasonic transducer (PMUT) array for ultrasound imaging. The novel design achieves high frequencies and reduced crosstalk, enabling potential shallow-depth sensing applications.
Area of Science:
- Materials Science
- Electrical Engineering
- Acoustics
Background:
- Micromachined ultrasonic transducers (MUTs) are crucial for ultrasound imaging and sensing.
- Developing cost-effective and high-performance MUT arrays remains a key challenge.
Purpose of the Study:
- To present a fully addressable 8x8 rigid piezoelectric micromachined ultrasonic transducer (PMUT) array.
- To demonstrate a low-cost fabrication process for PMUT arrays using standard silicon wafers.
- To characterize the performance of the PMUT array, focusing on frequency, sensitivity, coupling, crosstalk, and bandwidth.
Main Methods:
- Fabrication of PMUTs on a silicon wafer using deep reactive ion etching (DRIE).
- Integration of a polyimide passive layer for frequency tuning.
- Characterization of resonance frequency, sensitivity, effective coupling coefficient, interelement crosstalk, pressure response, and fractional bandwidth.
Main Results:
- A 3.2 MHz in-air frequency and 3 nm/V sensitivity were achieved with a 6 µm polyimide thickness.
- An effective coupling coefficient of 14% was calculated, with approximately 1% interelement crosstalk.
- A 70% -6 dB fractional bandwidth at a 1.7 MHz center frequency was observed underwater.
Conclusions:
- The fabricated PMUT array offers a low-cost solution for ultrasound imaging.
- The design demonstrates significant reduction in interelement crosstalk compared to existing technologies.
- The results indicate potential for imaging and sensing in shallow-depth applications.
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