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A low-profile electromechanical packaging system for soft-to-flexible bioelectronic interfaces.
Florian Fallegger1, Alix Trouillet1, Florent-Valéry Coen1
1Laboratory for Soft Bioelectronic Interfaces, Neuro-X Institute, Ecole Polytechnique Fédérale de Lausanne, Geneva, Switzerland.
APL Bioengineering
|August 21, 2023
Summary
Researchers developed FlexComb, a novel connector for soft bioelectronic devices. This technology ensures reliable connections between soft electronics and rigid boards, crucial for next-generation medical implants and wearables.
Area of Science:
- Bioelectronic engineering
- Materials science
- Medical device technology
Background:
- Next-generation bioelectronic circuits require seamless integration of electronics with the human body.
- Existing interfaces face challenges in mechanical compliance, biocompatibility, and scalable manufacturing.
- Connecting soft materials with rigid electronics necessitates reliable electromechanical connectors.
Purpose of the Study:
- To introduce a novel interconnection solution for soft-to-flexible bioelectronic interfaces.
- To demonstrate a reliable, scalable, and simple method for connecting soft transducing systems with electronic boards.
- To validate the performance and biocompatibility of the proposed interconnection technology.
Main Methods:
- Development of a laser-machined flexible printed circuit board structure termed FlexComb.
- Creation of a complementary pattern in the soft system for electromechanical interlocking.
- Utilizing a soft electrically conducting composite for connection.
- Testing electrical and electromechanical properties and submillimetric design variations.
- Conducting a 6-month in vivo study using a subdural electrocorticography system.
Main Results:
- The FlexComb technology enables a simple assembly process for robust soft-to-flexible interconnections.
- Demonstrated versatility and scalability through customized submillimetric designs.
- Validated long-term stability and biocompatibility in a 6-month in vivo implantation study.
- The interconnection maintained performance in a subdural electrocorticography system.
Conclusions:
- FlexComb offers a reliable and straightforward technique for bonding and connecting soft transducing systems with flexible or rigid electronic boards.
- This technology has significant potential for applications in soft robotics, wearable electronics, and implantable bioelectronics.
- The developed method addresses key limitations in current bioelectronic interface manufacturing and performance.
