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Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation

Shih-Hung Wang1, Wensyang Hsu1, Yan-Yu Liou2

  • 1Department of Mechanical Engineering, National Yang Ming Chiao Tung University, No. 1001, Ta Hsueh Road, East District, Hsinchu City 300010, Taiwan.

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Summary

Multi-chiplet integration using glass interposers offers low cost and high density. Stress simulations reveal epoxy molding compound thickness and via pitch significantly impact thermomechanical stress during chiplet device curing and operation.

Keywords:
TGVanalysis of variancefinite element analysismulti-chipletsubmodeling technique

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Area of Science:

  • Materials Science
  • Mechanical Engineering
  • Electrical Engineering

Background:

  • Multi-chiplet technology is a key enabler for high-density integration, offering advantages in power consumption and component utilization.
  • Glass interposers present a cost-effective alternative to silicon interposers for advanced packaging.
  • Understanding thermomechanical stress in these complex structures is crucial for reliability.

Purpose of the Study:

  • To investigate the thermomechanical stress responses in multi-chiplet systems utilizing glass interposers.
  • To identify critical structural design parameters influencing stress generation during the manufacturing process.
  • To evaluate the impact of epoxy molding compound (EMC) and via arrangement on stress distribution.

Main Methods:

  • Process-oriented stress simulation using finite element analysis (FEA) with element activation/deactivation.
  • Submodeling technique to handle scale mismatch and mesh complexity.
  • Full factorial design with analysis of variance (ANOVA) to assess parameter significance.

Main Results:

  • Maximum first principal stresses of 130.75 MPa on Cu-filled via sidewalls and 17.18 MPa at the glass interposer bottom were identified.
  • Epoxy molding compound (EMC) thickness and through-glass via pitch were found to be dominant factors influencing stress.
  • Significant stress variations were observed during heating and cooling cycles.

Conclusions:

  • Glass interposer-based multi-chiplet systems are viable for cost-effective high-density integration.
  • EMC thickness and via pitch are critical design parameters that must be optimized to mitigate thermomechanical stress.
  • FEA and ANOVA provide valuable insights into the reliability of advanced packaging technologies.