Active Thermal Control of IGBT Modules Based on Finite-Time Boundedness

Area of Science:

• Power Electronics
• Thermal Management
• Control Systems

Background:

• Thermal stress is a primary cause of power electronic module failure.
• Effective thermal management is crucial for reliable and cost-efficient energy conversion.
• Improving device reliability and system lifetime requires reducing thermal stress.

Purpose of the Study:

• To present an advanced active thermal control (ATC) strategy.
• To reduce the thermal stress amplitude in power devices during operation.
• To enhance the reliability and lifetime of power conversion systems.

Main Methods:

• Developed a state-space model using a Foster-type thermal model for real-time junction temperature estimation.
• Proposed a feedback controller based on finite-time boundedness (FTB) for precise temperature regulation.
• Implemented the controller to reduce thermal stress based on the temperature profile.

Main Results:

• The proposed ATC strategy effectively reduces thermal stress amplitude.
• The controller precisely regulates junction temperature, minimizing stress during rapid power demand changes.
• Simulation and experimental results validate the method's effectiveness.

Conclusions:

• The advanced ATC strategy significantly reduces thermal stress in power electronic devices.
• Precise temperature control via FTB-based feedback enhances system reliability and extends component lifetime.
• The developed method offers a viable solution for improving the performance and durability of power conversion systems.