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Highly Thermally Conductive and Structurally Ultra-Stable Graphitic Films with Seamless Heterointerfaces for Extreme
Peijuan Zhang1, Yuanyuan Hao1, Hang Shi1
1MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials and Technologies of Zhejiang Province, Zhejiang University, 38 Zheda Road, Hangzhou, 310027, People's Republic of China.
Graphitic films (GF) fail under extreme cold shocks. A new Cu-modified GF (GF@Cu) with a seamless interface shows excellent structural stability and high thermal conductivity after hundreds of cycles.
Area of Science:
- Materials Science
- Nanotechnology
- Thermal Engineering
Background:
- Graphitic films (GF) offer high thermal conductivity for electronics cooling.
- GF materials face structural failure under extreme thermal cycling, limiting their reliability.
Purpose of the Study:
- Investigate the failure mechanism of GF under cyclic liquid nitrogen shocks (LNS).
- Develop a robust GF material for extreme thermal management applications.
Main Methods:
- Investigated GF failure mechanism during cyclic liquid nitrogen shocks (77–300 K).
- Developed a novel metal-nanoarmor strategy using a Cu-modified graphitic film (GF@Cu).
- Characterized the structural stability and thermal conductivity of GF@Cu after LNS.
Main Results:
- Identified a
- permeation-diffusion-deformation
- bubbling process as the GF failure mechanism under LNS.
- GF@Cu demonstrated superior structural stability after hundreds of LNS cycles.
- GF@Cu maintained high thermal conductivity (1088 W m⁻¹ K⁻¹) with <5% degradation after 150 LNS cycles, compared to 50% for pure GF.
Conclusions:
- The metal-nanoarmor strategy effectively enhances the robustness of graphitic films.
- GF@Cu is a promising material for reliable thermal management in extreme environments.
- This work facilitates the use of advanced carbon-based materials in aerospace electronics.
