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CMOS Compatible Hydrogen Sensor Using Platinum Gate and ALD-Aluminum Oxide
Adham Elshaer1,2, Serge Ecoffey1,2, Abdelatif Jaouad1,2
1Institut Interdisciplinaire d'Innovation Technologique (3IT), Université de Sherbrooke, 3000 Boul. Université, Sherbrooke, QC J1K 0A5, Canada.
A novel metal oxide semiconductor (MOS) hydrogen sensor was developed using silicon and atomic layer deposited aluminum oxide. This CMOS-compatible device shows reliable performance for detecting hydrogen gas concentrations.
Area of Science:
- Materials Science
- Semiconductor Device Physics
- Chemical Sensing
Background:
- Hydrogen sensors are crucial for safety and industrial process monitoring.
- Existing sensors often face challenges with fabrication compatibility and reliability.
- Atomic Layer Deposition (ALD) offers precise thin-film fabrication for semiconductor devices.
Purpose of the Study:
- To fabricate and characterize a novel p-Si/ALD-Al2O3/Ti/Pt Metal Oxide Semiconductor (MOS) device for hydrogen sensing.
- To evaluate the sensor's performance using a reliable, industry-compatible CMOS fabrication process.
- To assess the integration potential of ALD-Al2O3 in CMOS post-processing.
Main Methods:
- Fabrication of a p-Si/ALD-Al2O3/Ti/Pt MOS stack.
- Utilizing Atomic Layer Deposition (ALD) for the Al2O3 layer.
- Testing the device's response and recovery characteristics with varying hydrogen concentrations at elevated temperatures.
Main Results:
- The fabricated MOS device demonstrated a clear correlation between capacitance variation and hydrogen concentration.
- Successful hydrogen detection down to 20 ppm at 140 °C was achieved.
- A response time of 56 seconds was recorded for a 500 ppm hydrogen concentration.
Conclusions:
- The p-Si/ALD-Al2O3/Ti/Pt MOS device is a viable candidate for hydrogen sensing applications.
- The CMOS-compatible fabrication process ensures industry relevance and scalability.
- ALD-Al2O3 is suitable for integration into back-end-of-line (BEOL) or post-processing CMOS steps.
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