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InGaAs membrane plasmonic photodetector with Ni-InGaAs alloy integrated on Si waveguide.
Optics Express
|February 20, 2026
Summary
We developed a hybrid plasmonic waveguide photodetector using InGaAs on a Si platform. This advancement simplifies fabrication and achieves high-speed performance for silicon photonics applications.
Area of Science:
- Photonics and optoelectronics
- Materials science
- Semiconductor device physics
Background:
- Silicon photonics offers high integration potential but lacks efficient on-chip photodetectors.
- III-V/Si hybrid integration is a promising approach to overcome silicon's limitations.
Purpose of the Study:
- To develop a high-speed, integrated photodetector for silicon photonics.
- To demonstrate the effectiveness of Ni-InGaAs alloy as an electrode for plasmonic waveguides.
- To simplify the fabrication process for hybrid plasmonic waveguide photodetectors.
Main Methods:
- Fabrication of a III-V/Si hybrid plasmonic waveguide photodetector incorporating an Indium Gallium Arsenide (InGaAs) membrane.
- Utilizing a Nickel-Indium Gallium Arsenide (Ni-InGaAs) alloy as an electrode.
- Characterization of device performance, including responsivity, dark current, and high-speed operation.
Main Results:
- The Ni-InGaAs alloy was confirmed to function effectively as an electrode for plasmonic waveguides.
- A simplified fabrication process enabled the integration of plasmonic waveguide photodetectors onto the Si photonics platform.
- Achieved a responsivity of 0.13 A/W at 1 V with a dark current of 400 nA.
- Demonstrated a 32.1 Gbit/s clear eye diagram, indicating high-speed capability.
Conclusions:
- The proposed III-V/Si hybrid plasmonic waveguide photodetector shows significant potential for high-speed applications in silicon photonics.
- The Ni-InGaAs alloy facilitates simplified integration and effective electrode function.
- This work paves the way for advanced optoelectronic integrated circuits on silicon platforms.

