Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

Mechanism of heat transfer01:19

Mechanism of heat transfer

1.2K
Understanding heat transfer mechanisms is essential for understanding how our bodies maintain balance in different environmental conditions. When the environment is thermoneutral, the body is in a state of balance, neither using nor releasing energy to maintain its core temperature. However, when the environment is not thermoneutral, the body employs four heat transfer mechanisms to maintain homeostasis: conduction, convection, evaporation, and radiation. These mechanisms facilitate heat...
1.2K
Mechanisms of Heat Transfer II01:20

Mechanisms of Heat Transfer II

3.2K
In convection, thermal energy is carried by the large-scale flow of matter. Ocean currents and large-scale atmospheric circulation, which result from the buoyancy of warm air and water, transfer hot air from the tropics toward the poles and cold air from the poles toward the tropics. The Earth’s rotation interacts with those flows, causing the observed eastward flow of air in the temperate zones. Convection dominates heat transfer by air, and the amount of available space for the airflow...
3.2K
Mechanisms of Heat Transfer01:14

Mechanisms of Heat Transfer

320
Heat transfer between the human body and its environment occurs through four main mechanisms: conduction, convection, radiation, and evaporation.
Conduction, accounting for approximately 3% of body heat loss at rest, is the process of exchanging heat between molecules of two materials in direct contact. This can result in both heat loss and gain. For instance, when the body is submerged in water, which conducts heat 20 times more effectively than air, it can either lose or gain significant...
320
Mechanisms of Heat Transfer I01:14

Mechanisms of Heat Transfer I

4.2K
Just as interesting as the effects of heat transfer on a system are the methods by which the heat transfer occur. Whenever there is a temperature difference, heat transfer occurs. It may occur rapidly, such as through a cooking pan, or slowly, such as through the walls of a picnic ice box. So many processes involve heat transfer that it is hard to imagine a situation where no heat transfer occurs. Yet, every heat transfer takes place by only three methods: conduction, convection, and radiation.
4.2K
Thermal Stress01:09

Thermal Stress

2.4K
If the temperature of an object is changed while it is prevented from expanding or contracting, the object is subjected to stress. The stress is compressive if the object expands in the absence of constraint and tensile if it contracts. This stress resulting from temperature change is known as thermal stress. It can be quite large and can cause damage. To avoid this stress, engineers may design components so they can expand and contract freely. For instance, on highways, gaps are deliberately...
2.4K
Non-ohmic Devices00:51

Non-ohmic Devices

1.1K
In most substances, the current flow is proportional to the voltage applied to it. A simple relationship between the values of current, voltage, and resistance is known as Ohm's law. Nonohmic devices do not exhibit a linear relationship between voltage and current. One such device is the semiconducting circuit element known as a diode. A diode is a circuit device that allows current flow in only one direction.
Consider a simple circuit consisting of a battery, a diode, and a resistor. A...
1.1K

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Synergistic Lewis Acid Photocatalysis Over Cluster-Defect-Engineered UiO-66 for Efficient Liquid Biomass Upgrading.

Angewandte Chemie (International ed. in English)·2026
Same author

Vacancy-Anchored Single-Atom Nb<sub>2</sub>CO<sub>2</sub> MXene: Electronic Origins of Multi-Site Cooperative Trifunctional Electrocatalysis.

ACS applied materials & interfaces·2026
Same author

Overcoming redox barriers in black phosphorus negative electrodes through lattice P-N engineering for fast-charging Li-ion batteries.

Nature communications·2026
Same author

Efficacy and Safety of Intra-articular Sodium Hyaluronate for Ankle-involved Kashin-Beck Disease: A 12-month Prospective Self-controlled Study.

Journal of visualized experiments : JoVE·2026
Same author

Solar-Driven Ammonia Synthesis over a Silver-Only Antenna-Reactor Catalyst.

Journal of the American Chemical Society·2026
Same author

Investigation of Flow Boiling Heat Transfer Performance of Grooved Metal Foam (Ni, Cu) Evaporators.

Micromachines·2026

Related Experiment Video

Updated: Jun 24, 2025

Pool-Boiling Heat-Transfer Enhancement on Cylindrical Surfaces with Hybrid Wettable Patterns
07:32

Pool-Boiling Heat-Transfer Enhancement on Cylindrical Surfaces with Hybrid Wettable Patterns

Published on: April 10, 2017

9.0K

Ultrafast Unidirectional On-Chip Heat Transfer.

Junbo Yang1,2,3, Miao Liu1,2,3, Tanhe Wang1,2

  • 1School of Mechanical, Electrical and Information Engineering, Shandong University, Weihai, 264209, China.

Small (Weinheim an Der Bergstrasse, Germany)
|June 11, 2024
PubMed
Summary

Silicon-based valley photonic crystals (VPCs) enable ultrafast, unidirectional heat transfer via thermal radiation. This defect-immune approach overcomes limitations of traditional methods for enhanced electronic component performance.

Keywords:
defect immuneradiative heat transfertopological photonicsunidirectional thermal transfervalley photonic crystal

More Related Videos

Measurements of Local Instantaneous Convective Heat Transfer in a Pipe - Single and Two-phase Flow
08:25

Measurements of Local Instantaneous Convective Heat Transfer in a Pipe - Single and Two-phase Flow

Published on: April 30, 2018

7.1K
Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
08:21

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

12.4K

Related Experiment Videos

Last Updated: Jun 24, 2025

Pool-Boiling Heat-Transfer Enhancement on Cylindrical Surfaces with Hybrid Wettable Patterns
07:32

Pool-Boiling Heat-Transfer Enhancement on Cylindrical Surfaces with Hybrid Wettable Patterns

Published on: April 10, 2017

9.0K
Measurements of Local Instantaneous Convective Heat Transfer in a Pipe - Single and Two-phase Flow
08:25

Measurements of Local Instantaneous Convective Heat Transfer in a Pipe - Single and Two-phase Flow

Published on: April 30, 2018

7.1K
Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
08:21

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

12.4K

Area of Science:

  • Materials Science
  • Nanotechnology
  • Thermal Engineering

Background:

  • Effective heat transfer is crucial for electronic device performance and stability.
  • Current thermal management strategies, including metamaterials, struggle with unidirectional and rapid heat flow control.
  • Material defects significantly impair thermal conductivity, degrading heat transfer efficiency.

Purpose of the Study:

  • To propose and numerically demonstrate a novel method for ultrafast, unidirectional heat transfer using silicon-based valley photonic crystals (VPCs).
  • To achieve significant thermal rectification and defect-immune heat transfer for microscale applications.
  • To overcome the limitations of conventional heat conduction in electronic devices.

Main Methods:

  • Utilizing silicon-based valley photonic crystals (VPCs) for thermal radiation manipulation.
  • Operating within the infrared wavelength region to achieve thermal rectification.
  • Numerical demonstration of heat flow control and robustness against defects.

Main Results:

  • Demonstrated ultrafast and unidirectional heat transfer through thermal radiation.
  • Achieved significant thermal rectification, ensuring efficient heat flow along designed paths.
  • VPCs exhibit inherent robustness, providing defect-immune heat transfer unaffected by temperature gradients.

Conclusions:

  • Silicon-based VPCs offer a promising solution for advanced thermal management in microscale devices.
  • The proposed method enhances heat transfer efficiency and stability, overcoming traditional limitations.
  • CMOS compatibility ensures broad applicability, especially in integrated optoelectronic devices.