You might also read
Articles linked to this work by shared authors, journal, and citation graph.
Updated: Jun 21, 2026

Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices
Published on: January 17, 2017
Xiaoming Xie1,2, Yulian Jiang2, Xiaoman Yao1
1School of Chemistry, South China Normal University, Guangzhou, 510006, PR China.
Scientists developed a new solvent-free adhesive that works in extreme cold, outperforming hot melt adhesives. This ultra-low temperature resistant adhesive offers long-lasting adhesion for Arctic, Antarctic, and space exploration.
Area of Science:
Background:
Purpose of the Study:
Main Methods:
Main Results:
Conclusions: