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Aluminum/Graphene Thermal Interface Materials with Positive Temperature Dependence.
Wanwan Cai1, Yongkuan Lu1, Chenxi Wang1
1Department of Chemical and Biochemical Engineering, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, P. R. China.
We developed graphene-aluminum composites with enhanced thermal conductivity. These materials show improved heat dissipation, offering a promising solution for thermal interface materials.
Area of Science:
- Materials Science
- Nanotechnology
- Thermal Engineering
Background:
- Graphene possesses high in-plane thermal conductivity, making it suitable for thermal interface materials (TIMs).
- The limited through-plane thermal conductivity of graphene hinders its application in TIMs.
- Developing strategies to enhance through-plane thermal conductivity is crucial for advanced TIMs.
Purpose of the Study:
- To develop a simple in situ method for preparing graphene-based composites with enhanced through-plane thermal conductivity.
- To investigate the temperature-dependent thermal properties of these novel composites.
- To explore the potential of these composites as superior heat dissipation materials.
Main Methods:
- An in situ growth method was employed to load aluminum (Al) nanoparticles onto graphene nanoplatelets (GNPs).
- Thermal diffusivity and specific heat capacity were measured using a laser-flash analyzer and differential scanning calorimetry.
- The through-plane thermal conductivity (k⊥) was evaluated at various temperatures.
Main Results:
- The Al nanoparticles effectively bridged graphene nanoplatelets, significantly enhancing k⊥.
- The 1.3-Al/GNPs composite achieved a k⊥ of 11.70 W·m⁻¹·K⁻¹ at 25 °C.
- A unique positive temperature-dependent k⊥ was observed, reaching 20.93 W·m⁻¹·K⁻¹ at 100 °C.
Conclusions:
- The developed Al/GNPs composites exhibit exceptional heat transport properties.
- The enhanced k⊥ and temperature-dependent behavior offer a promising pathway for advanced graphene-based TIMs.
- This study provides valuable insights into designing high-performance thermal management materials.
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