Scanning Electron Microscopy
Fermi Level Dynamics
Metal-Semiconductor Junctions
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Updated: Jun 23, 2025

Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope
Published on: May 28, 2016
Hao-Yu Chen1, Hung-Chang Hsu2, Jhih-Yuan Liang2
1Graduate School of Advanced Technology, National Taiwan University, Taipei 10617, Taiwan.
Researchers engineered atomic-scale defects in transition metal dichalcogenides (TMDs) to understand electron-defect interactions. This defect engineering improves carrier transport for next-generation electronic technologies.
07:24Quantitative Atomic-Site Analysis of Functional Dopants/Point Defects in Crystalline Materials by Electron-Channeling-Enhanced Microanalysis
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11:33All-electronic Nanosecond-resolved Scanning Tunneling Microscopy: Facilitating the Investigation of Single Dopant Charge Dynamics
Published on: January 19, 2018
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